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Introduction
STD7312 is an epoxy high-temperature curing adhesive. After curing, this product exhibits excellent bonding strength to common substrates such as metals, plastics, ceramics, and composite materials. With outstanding high-temperature resistance and adhesion properties, it is widely used for metal bonding in high-temperature environments. Applications include high-temperature dispensing, thin-layer bonding, gap filling, and potting.
Key Features
High Toughness: Provides excellent mechanical strength and durability, ensuring long-term performance.
Low-Temperature Performance: Maintains its properties at low temperatures, making it suitable for cold environments.
Chemical Resistance: Resistant to common chemicals and solvents, ensuring stability in various operating conditions.
Versatile Application: Suitable for a wide range of electronic components, including printed circuit boards (PCBs) and transformers.
Applications
Electronics: Ideal for encapsulating and protecting electronic components from moisture, chemicals, and mechanical stress.
Automotive: Used in automotive electronics to protect components from harsh environmental conditions.
Industrial Equipment: Suitable for industrial applications where components need to be protected from vibration and impact.
Mechanical and Physical Specifications
| Property | Value |
|---|---|
| Operating Temperature Range | -45°C to 125°C |
| Viscosity | Medium to high viscosity, suitable for potting and encapsulation |
| Cure Time | Varies depending on the application and curing method |
| Thermal Conductivity | Moderate to high, ensuring efficient heat dissipation |
| Chemical Resistance | Resistant to common chemicals and solvents |
Usage and Suggestions
Surface Preparation: Ensure surfaces are clean and free from contaminants before application.
Application Method: Apply using a brush, spray, or automated dispensing equipment. The compound can be applied in various thicknesses depending on the application.
Curing: Cure the compound according to the manufacturer’s instructions. Curing methods may include room temperature curing, heat curing, or UV curing.
Safety: When working with potting compounds, use appropriate personal protective equipment (PPE) and work in a well-ventilated area.
High-Toughness Resin Potting Compound STD7321 is a reliable choice for applications requiring high toughness and durability. Its versatile properties make it suitable for a wide range of electronic and industrial applications.